CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE
The present invention relates to a cleaning liquid to reduce a corrosion potential difference between metals and a method for cleaning a substrate. According to the present invention, the substrate comprises a first metal atom-containing layer containing ruthenium and a second metal atom-containing...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
05.07.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The present invention relates to a cleaning liquid to reduce a corrosion potential difference between metals and a method for cleaning a substrate. According to the present invention, the substrate comprises a first metal atom-containing layer containing ruthenium and a second metal atom-containing layer containing metal atoms except for ruthenium are in contact with the first metal atom-containing layer. The cleaning liquid cleans the substrate on which at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on the surface. The cleaning liquid comprises: at least one hydrazine compound (A) selected from a group consisting of a compound represented by the chemical formula (a1) and a hydrate and salt thereof; and at least one basic compound (B) selected from a group consisting of amines except for the hydrazine compound (A) and quaternary hydroxides, wherein R^1 and R^2 independently represent an organic group not containing a carbonyl group or a hydrogen atom, respectively.
루테늄을 함유하는 제 1 금속 원자 함유층과 루테늄 이외의 금속 원자를 함유하는 제 2 금속 원자 함유층이 접촉하여 존재하는 기판으로서, 상기 제 1 금속 원자 함유층 및 상기 제 2 금속 원자 함유층의 적어도 일방이 표면에 노출된 기판을 세정하기 위한 세정액. 하기 식 (a1) 로 나타내는 화합물, 상기 화합물의 수화물, 및 상기 화합물의 염으로 이루어지는 군에서 선택되는 적어도 1 종의 하이드라진 화합물 (A) 와, 상기 하이드라진 화합물 (A) 이외의 아민, 및 제 4 급 수산화물로 이루어지는 군에서 선택되는 적어도 1 종의 염기성 화합물 (B) 를 포함한다. R1 및 R2 는, 카르보닐기를 포함하지 않는 유기기 또는 수소 원자를 나타낸다. JPEGpat00019.jpg3482 |
---|---|
AbstractList | The present invention relates to a cleaning liquid to reduce a corrosion potential difference between metals and a method for cleaning a substrate. According to the present invention, the substrate comprises a first metal atom-containing layer containing ruthenium and a second metal atom-containing layer containing metal atoms except for ruthenium are in contact with the first metal atom-containing layer. The cleaning liquid cleans the substrate on which at least one of the first metal atom-containing layer and the second metal atom-containing layer is exposed on the surface. The cleaning liquid comprises: at least one hydrazine compound (A) selected from a group consisting of a compound represented by the chemical formula (a1) and a hydrate and salt thereof; and at least one basic compound (B) selected from a group consisting of amines except for the hydrazine compound (A) and quaternary hydroxides, wherein R^1 and R^2 independently represent an organic group not containing a carbonyl group or a hydrogen atom, respectively.
루테늄을 함유하는 제 1 금속 원자 함유층과 루테늄 이외의 금속 원자를 함유하는 제 2 금속 원자 함유층이 접촉하여 존재하는 기판으로서, 상기 제 1 금속 원자 함유층 및 상기 제 2 금속 원자 함유층의 적어도 일방이 표면에 노출된 기판을 세정하기 위한 세정액. 하기 식 (a1) 로 나타내는 화합물, 상기 화합물의 수화물, 및 상기 화합물의 염으로 이루어지는 군에서 선택되는 적어도 1 종의 하이드라진 화합물 (A) 와, 상기 하이드라진 화합물 (A) 이외의 아민, 및 제 4 급 수산화물로 이루어지는 군에서 선택되는 적어도 1 종의 염기성 화합물 (B) 를 포함한다. R1 및 R2 는, 카르보닐기를 포함하지 않는 유기기 또는 수소 원자를 나타낸다. JPEGpat00019.jpg3482 |
Author | WADA YUKIHISA GO CHOITSU WAKIYA KAZUMASA SERIZAWA KOHEI |
Author_xml | – fullname: SERIZAWA KOHEI – fullname: GO CHOITSU – fullname: WADA YUKIHISA – fullname: WAKIYA KAZUMASA |
BookMark | eNrjYmDJy89L5WQwdPZxdfTz9HNX8PEMDPV0UXD0c1HwdQ3x8HdRcPMPUoBLB4c6BYcEOYa48jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMjYwNDAwMzU0tHY-JUAQDPMCjs |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
DocumentTitleAlternate | 세정액, 및 기판의 세정 방법 |
ExternalDocumentID | KR20230100659A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_KR20230100659A3 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 09 05:00:41 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Korean |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_KR20230100659A3 |
Notes | Application Number: KR20220183282 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230705&DB=EPODOC&CC=KR&NR=20230100659A |
ParticipantIDs | epo_espacenet_KR20230100659A |
PublicationCentury | 2000 |
PublicationDate | 20230705 |
PublicationDateYYYYMMDD | 2023-07-05 |
PublicationDate_xml | – month: 07 year: 2023 text: 20230705 day: 05 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | TOKYO OHKA KOGYO CO., LTD |
RelatedCompanies_xml | – name: TOKYO OHKA KOGYO CO., LTD |
Score | 3.4324138 |
Snippet | The present invention relates to a cleaning liquid to reduce a corrosion potential difference between metals and a method for cleaning a substrate. According... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
Title | CLEANING LIQUID AND METHOD FOR CLEANING SUBSTRATE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230705&DB=EPODOC&locale=&CC=KR&NR=20230100659A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_m_HzTqfgxpaD0rdjadm4PRdqmdXNbO2snexvNR0GUdriK_75J3Oae9hJIDo5L4HJ3ye_uAG6p3cpM0s40w8JUsxjDWueeD1lGbemvWrKdzzBqdcfW88Se1OBzmQsj64T-yOKIXKMI1_dK3tez_0csJLGV8zv8zpfKxzB1kLqIjgWqWbdV5DnBKEaxr_q-00_UKPmjGcLgdtwt2OaO9IPQh-DNE3kps3WjEh7CzojzK6ojqH2UDdj3l73XGrA3XHx5N2BXYjTJnC8u9HB-DIY_CNyoFz0pg97LuIcUN0LKMEi7MVJ4WKesyK9jT3RFToMTuAmD1O9qXIrpatPTfrIusnkK9aIs2BkoOqU5Eb06bdK2cI6xqWcWoZSwnDGD4nNobuJ0sZl8CQdiKgGpdhPq1dc3u-Jmt8LX8rR-AShxgYw |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8JAEJ4gPvCmqPGB2kTTWyOVFuHQmNItttIWrK3hRrqPJkZTiNT4991dATlx2cN8yWR2k9mZ2Z0HwC0121mLdDJNNzDVDMaw1r3nS5ZRU_qrhhznE0ZtLzWex-a4Ap_LWhjZJ_RHNkfkGkW4vpfyvp79P2IhmVs5v8PvnDR97CcWUhfRschqbpoq6lnuaIiGjuo41iBWo_gP04XB7dpbsM2d7AehD-5bT9SlzNaNSv8AdkacX1EeQuVjWoeas5y9Voe9cPHlXYddmaNJ5py40MP5EehO4NqRHz0pgf-S-kixI6SEbuINkcLDOmUFv6Y9MRU5cY_hpu8mjqdxKSarTU8G8brIrROoFtOCnYLSpDQnYlanSToGzjFuNTODUEpYzphO8Rk0NnE63wxfQ81LwmAS-NHgAvYFJJNTzQZUy69vdslNcImv5Mn9AmdjhH8 |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=CLEANING+LIQUID+AND+METHOD+FOR+CLEANING+SUBSTRATE&rft.inventor=SERIZAWA+KOHEI&rft.inventor=GO+CHOITSU&rft.inventor=WADA+YUKIHISA&rft.inventor=WAKIYA+KAZUMASA&rft.date=2023-07-05&rft.externalDBID=A&rft.externalDocID=KR20230100659A |