HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FILM PREPREG LAMINATE AND PRINTED-WIRING BOARD

• Main Authors: HIRANO FUMIYA, TSUURA ATSUSHI, KUDO YUKI, YAMAGUCHI SHINSUKE, IGUCHI HIROYUKI, TSUTSUMI YOSHIHIRO, IKEDA TADAHARU
• Format: Patent
• Language: English; Korean
• Published: 09.05.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Provided is a thermosetting maleimide resin composition that provides a cured product with excellent dielectric properties, low water absorption, and high glass transition temperature even in a high frequency range. The thermosetting maleimide resin composition, as a thermosetting maleimide resin composition containing (A) two or more maleimide compounds having one or more hydrocarbon groups derived from a dimer acid skeleton in one molecule, and (B) a reaction initiator, has a dielectric loss tangent of 0.003 or less at 10 GHz and 40 GHz, respectively. 고주파 영역에 있어서도 유전 특성이 우수하고, 저흡수율이며, 높은 유리 전이 온도를 갖는 경화물을 부여하는 열경화성 말레이미드 수지 조성물 등의 제공. (A) 1분자 중에 다이머산 골격 유래의 탄화수소기를 1개 이상 갖는 말레이미드 화합물을 2종 이상, (B) 반응 개시제를 함유하는 열경화성 말레이미드 수지 조성물로서, 해당 열경화성 말레이미드 수지 조성물의 경화물의 10㎓ 및 40㎓의 유전정접이 각각 0.003 이하인 열경화성 말레이미드 수지 조성물.