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Abstract A technology disclosed in this specification relates to a deposition ring provided around a wafer to prevent particles to be deposited on the wafer from being separated by an electrostatic chuck. In the deposition ring comprising a ridge part forming a predetermined surface roughness, the ridge part comprises: molten beads of metal powder laminated using laser metal rapid prototyping technology. The technology disclosed in this specification creates the ridge part that forms the surface roughness of the deposition ring by using laser metal rapid prototyping technology. Since it is possible to form a ridge part (10) in the form of a stack of a plurality of molten beads made of melted metal powder, the present invention provides the effect of forming another roughness on the side of the ridge part and creating a regular shape of the entire ridge part by using laser metal rapid prototyping technology. 본 명세서에서 개시하는 기술은 웨이퍼 둘레에 마련되어 웨이퍼에 증착시키고자 하는 입자들이 정전척에 박리되는 것을 방지할 수 있는 데포지션 링에 관한 것으로, 소정의 표면 거칠기를 형성하는 융기부를 포함하는 데포지션 링에 있어서, 상기 융기부는 레이저 금속 쾌속조형 기술을 이용하여 금속분말의 용융 비드가 적층된 것을 포함한다. 본 명세서에서 개시하는 기술은 데포지션 링의 표면 거칠기를 형성하는 융기부를 레이저 금속 쾌속조형 기술을 이용하여 생성됨으로써, 금속분말이 용융된 다수의 용융 비드가 적층된 형태의 융기부(10)를 형성할 수 있는 바, 융기부 측면에 또 다른 거칠기를 형성할 수 있는 효과가 있고, 레이저 금속 쾌속조형 기술에 의한 융기부 전체의 형상을 규칙적으로 생성할 수 있는 효과가 있다.
AbstractList A technology disclosed in this specification relates to a deposition ring provided around a wafer to prevent particles to be deposited on the wafer from being separated by an electrostatic chuck. In the deposition ring comprising a ridge part forming a predetermined surface roughness, the ridge part comprises: molten beads of metal powder laminated using laser metal rapid prototyping technology. The technology disclosed in this specification creates the ridge part that forms the surface roughness of the deposition ring by using laser metal rapid prototyping technology. Since it is possible to form a ridge part (10) in the form of a stack of a plurality of molten beads made of melted metal powder, the present invention provides the effect of forming another roughness on the side of the ridge part and creating a regular shape of the entire ridge part by using laser metal rapid prototyping technology. 본 명세서에서 개시하는 기술은 웨이퍼 둘레에 마련되어 웨이퍼에 증착시키고자 하는 입자들이 정전척에 박리되는 것을 방지할 수 있는 데포지션 링에 관한 것으로, 소정의 표면 거칠기를 형성하는 융기부를 포함하는 데포지션 링에 있어서, 상기 융기부는 레이저 금속 쾌속조형 기술을 이용하여 금속분말의 용융 비드가 적층된 것을 포함한다. 본 명세서에서 개시하는 기술은 데포지션 링의 표면 거칠기를 형성하는 융기부를 레이저 금속 쾌속조형 기술을 이용하여 생성됨으로써, 금속분말이 용융된 다수의 용융 비드가 적층된 형태의 융기부(10)를 형성할 수 있는 바, 융기부 측면에 또 다른 거칠기를 형성할 수 있는 효과가 있고, 레이저 금속 쾌속조형 기술에 의한 융기부 전체의 형상을 규칙적으로 생성할 수 있는 효과가 있다.
Author JANG JI HYUN
SHIN SEOK JIN
SUKHYUN SEO
SIM CHUL YONG
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Snippet A technology disclosed in this specification relates to a deposition ring provided around a wafer to prevent particles to be deposited on the wafer from being...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title DEPOSITION RING
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