LIQUID-COOLED ASSEMBLY AND METHOD

• Main Authors: YANG LIQIANG, EDDINS RICHARD ANTHONY, YIN LIANG, KAPUSTA CHRISTOPHER JAMES, RUSH BRIAN MAGANN, SWANSON JUDD EVERETT, ESLER DAVID RICHARD
• Format: Patent
• Language: English; Korean
• Published: 19.04.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

본 개시는 전자 부품의 액체 냉각용 장치 및 방법에 관한 것이다. 하우징은 삽입 슬롯을 포함하며, 전자 부품을 운반하기 위한 적어도 하나의 부품 챔버를 획정한다. 하우징에는 유체 유입구와 유체 유출구가 제공된다. 액체 냉각제 회로는 적어도 유입구로부터 유출구까지 하우징을 통과한다. The disclosure relates to an apparatus and method for liquid cooling of an electronic component (14, 24, 114A, 114B). A housing (12, 112) includes an insertion slot (38, 40, 138) and defines at least one component chamber (52, 152, 154) for carrying the electronic component (14, 24, 114A, 114B). A fluid inlet (42, 142) and fluid outlet (44, 144) are provided on the housing (12, 112). A liquid coolant circuit (92, 192) passes through the housing (12, 112) at least from the inlet (42, 142) to the outlet (44, 144). The liquid coolant circuit comprises a first and a second impingement sprayer (66,68,166,168,170) inside the component chamber.