resin composition for self-assembled conductive bonding film self-assembled conductive bonding film comprising the same and manufacturing method thereof

• Main Authors: LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
• Format: Patent
• Language: English; Korean
• Published: 27.02.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to a resin composition for a self-fusing type conductive bonding film, a self-fusing type conductive bonding film comprising the same and a manufacturing method thereof, and more specifically, to a resin composition for a self-fusing type conductive bonding film, which has excellent self-adhesiveness that can electrically, physically and chemically bond circuit members, as well as excellent adhesive strength, has excellent self-fusing properties even in bump formation and has transparency, a self-fusing type conductive bonding film comprising the same and a manufacturing method thereof. 본 발명은 자가융착형 도전접속필름용 수지조성물, 이를 포함하는 자가융착형 도전접속필름 및 이의 제조방법에 관한 것으로써, 보다 상세하게는 회로부재 간을 전기적, 물리적 및 화학적으로 접합시킬 수 있는 자가융착성이 우수할 뿐만 아니라, 접착력 또한 우수하고, 범프 형성에 있어서도 자가융착성이 우수하며, 투명성을 가지는 자가융착형 도전접속필름용 수지조성물, 이를 포함하는 자가융착형 도전접속필름 및 이의 제조방법에 관한 것이다.