EPOXY RESIN AND CURABLE COMPOSITION CONTAINING THE EPOXY RESIN

• Main Authors: AOYAMA KAZUMASA, HIROTA YOUSUKE, YAMOTO KAZUHISA
• Format: Patent
• Language: English; Korean
• Published: 10.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present disclosure is to provide an epoxy resin, which does not impair the low viscosity at the time of melting, and moreover, is capable of achieving low moisture absorption, low elasticity and high adhesion of cured articles at a high degree, and a curable composition containing the epoxy resin. The present disclosure relates to the epoxy resin, a glycidyl etherified product of a polyhydric hydroxy resin, which uses, as reaction raw materials (1), an aromatic compound (A) having an aromatic ring to which phenolic hydroxyl group is bonded, and at least one monovalent hydrocarbon group at a meta position of the aromatic ring, and an aromatic divinyl compound (B1). [과제] 본 개시는, 용융시의 저점도성을 손상시키지 않고, 또한, 경화물의 저흡습률, 열시 저탄성 및 고밀착성을 고차로 양립할 수 있는 에폭시 수지 및 당해 에폭시 수지를 함유하는 경화성 조성물을 제공하는 것을 목적으로 한다. [해결 수단] 본 개시는, 페놀성 수산기가 결합된 방향환 및 상기 방향환의 메타 위치에 1가의 탄화수소기를 적어도 하나 갖는 방향족 화합물(A)과, 방향족 디비닐 화합물(B1)을 반응 원료(1)로 하는 다가 히드록시 수지의 글리시딜에테르화물인 에폭시 수지이다.