Suction apparatus for laser machining and apparatus for laser machining having the same

• Main Authors: KIM BYUNG SU, UM TAE JUN, KIM SUNG JIN, KIM DAE YOU
• Format: Patent
• Language: English; Korean
• Published: 11.11.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a suction device for laser processing and a laser processing device including the same, and more particularly, to a suction device for laser processing that sucks process by-products from laser processing and a laser processing device including the same. The suction...