POLYIMIDE RESIN COMPOSITION RESIN FILM LAMINATE COVERLAY FILM COPPER FOIL WITH RESIN METAL-CLAD LAMINATE PLATE AND CIRCUIT BOARD

• Main Authors: NAKAJIMA YOSHITO, SUTO YOSHIKI
• Format: Patent
• Language: English; Korean
• Published: 05.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The present invention is to provide polyimide which uses dimer diamine as a raw material and enables formation of a resin film having both low dielectric loss tangent and excellent adhesion. The polyimide contains: 40 mol% or more and 95 mol% or less of a diamine residue derived from a dimer diamine composition containing dimer diamine, which is obtained by substituting a primary aminomethyl group or an amino group for each of two terminal carboxylic acid groups of a dimer acid, as a main component with respect to the total of diamine residues; and 5 mol% or more and 25 mol% or less of a diamine residue that is derived from a diamine compound, which contains a biphenyl skeleton or a naphthalene skeleton, wherein the biphenyl skeleton or the naphthalene skeleton has a substituent having at least one or more inter-carbon double bonds selected from the group consisting of a vinyl group, an acrylic group, a methacrylic group and an allyl group. (과제) 본 발명은, 다이머디아민을 원료로서 사용하고, 낮은 유전정접과 우수한 접착성을 겸비한 수지필름을 형성할 수 있는 폴리이미드를 제공하는 것이다. (해결수단) 전체 디아민 잔기에 대하여, 다이머산의 2개의 말단 카르복시산기가 1급 아미노메틸기 또는 아미노기로 치환되어 이루어지는 다이머디아민을 주성분으로 하는 다이머디아민 조성물에서 유래하는 디아민 잔기를 40몰％ 이상 95몰％ 이하의 범위 내에서 함유함과 아울러, 비페닐 골격 또는 나프탈렌 골격을 포함하고, 상기 비페닐 골격 또는 상기 나프탈렌 골격이 비닐기, 아크릴기, 메타크릴기 및 알릴기로 이루어지는 군에서 선택되는 적어도 1종 이상의 탄소간 이중결합을 구비하는 치환기를 구비하고 있는 디아민 화합물로부터 유도되는 디아민 잔기를 5몰％ 이상 25몰％ 이하의 범위 내에서 함유하는 폴리이미드.