Resin Composition Manufacturing Method of Cured Body and Cured Body

• Main Authors: HIKIDA JIRO, SHIOTA DAI
• Format: Patent
• Language: English; Korean
• Published: 26.07.2022
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

The purpose of the present invention is to provide: a resin composition comprising polyamic acid capable of stably forming a cured product comprising polyimide and having excellent film-forming properties; a preparation method of a cured product using the resin composition; and a cured product obtained by curing the resin composition. In a resin composition comprising polyamic acid (A), at least one selected from a group consisting of a carbonyl oxy compound (B1) having a -CO-O- bond in a molecule and a basic nitrogen-containing compound (B2) not having a -CO-O- bond in a molecule is blended. 제막성이 우수하고 폴리이미드를 포함하는 경화물을 안정적으로 형성할 수 있는 폴리아믹산을 함유하는 수지 조성물과 상기 수지 조성물을 이용하는 경화물의 제조 방법과 상기 수지 조성물을 경화하여 이루어지는 경화물을 제공하는 것. 폴리아믹산(A)을 함유하는 수지 조성물에, 분자 내에 -CO-O- 결합을 가지는 카르보닐옥시 화합물(B1), 및 분자 내에 -CO-O- 결합을 가지지 않는 염기성 함질소 화합물(B2)로 이루어진 군으로부터 선택되는 1종 이상을 배합한다.