PRINTED CIRCUIT BOARD AND MEHOD OF MANUFACTURING THEREOF

A printed circuit board according to an embodiment comprises: a first insulating layer; and a first circuit pattern layer disposed on an upper surface of the first insulating layer, wherein the first insulating layer comprises a first area corresponding to a dummy area and a second area other than t...

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Bibliographic Details
Main Authors KIM DONG SUN, NAM SANG HYUCK, RYU SUNG WUK
Format Patent
LanguageEnglish
Korean
Published 27.05.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board according to an embodiment comprises: a first insulating layer; and a first circuit pattern layer disposed on an upper surface of the first insulating layer, wherein the first insulating layer comprises a first area corresponding to a dummy area and a second area other than that of the first area, the first circuit pattern layer comprises a first dummy pattern disposed in the first area of the first insulating layer, and the first dummy pattern exposes an upper surface of the first area of the first insulating layer and comprises a plurality of dot-shaped first openings mutually spaced apart. Therefore, the present invention is capable of providing the printed circuit board capable of removing a remaining basic gas. 실시 예에 따른 인쇄회로기판은 제1 절연층; 및 상기 제1 절연층의 상면 위에 배치된 제1 회로 패턴층을 포함하고, 상기 제1 절연층은, 더미 영역에 대응하는 제1 영역 및 상기 제1 영역 이외의 제2 영역을 포함하고, 상기 제1 회로 패턴층은, 상기 제1 절연층의 상기 제1 영역에 배치되는 제1 더미 패턴을 포함하고, 상기 제1 더미 패턴은, 상기 제1 절연층의 상기 제1 영역의 상면을 노출하며, 상호 이격되는 도트 형태의 복수의 제1 개구를 포함한다.
Bibliography:Application Number: KR20200156476