기판 프로세싱 챔버

• Main Authors: VENKATASUBRAMANIAN ESWARANAND, HAYWOOD EDWARD, MALLICK ABHIJIT B, WONG CARLATON, GARNER STEPHEN C, FISCHBACH ADAM, FRANKLIN TIMOTHY JOSEPH, MANNA PRAMIT
• Format: Patent
• Language: Korean
• Published: 03.01.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 개시내용의 실시예들은 일반적으로, 반도체 디바이스들의 제조에서 이용되는 장치 및 방법들에 관한 것이다. 더 구체적으로, 본 개시내용의 실시예들은 반도체 디바이스들을 형성하기 위한 기판 프로세싱 챔버, 및 그의 컴포넌트들에 관한 것이다. Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.