METHOD FOR PRODUCING WIRING SUBSTRATE

• Main Authors: MORI RENTARO, YANAGIMOTO HIROSHI, OKAMOTO KAZUAKI, KURODA KEIJI, KONDOH HARUKI
• Format: Patent
• Language: English; Korean
• Published: 03.01.2022
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

Provided is a method for manufacturing a wiring board having a wiring layer with a predetermined wiring pattern by using a solid electrolyte membrane. The method of the present invention comprises the following steps of: preparing a base material having a seed layer, wherein the base material having...