수지 조성물

• Main Authors: FRANK CHRISTIAN, GMEINER ROBERT, GORSCHE CHRISTIAN
• Format: Patent
• Language: Korean
• Published: 10.06.2021
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

내고온성 재료를 형성하는 고온에서의 3차원 프린팅을 위한 수지 조성물로서, 수지 조성물은 하기 화학식(I)에 따른 말레이미드 유도체의 모노머 및/또는 올리고머 및/또는 프리폴리머를 포함하는 군으로부터 선택된 하나 이상의 화학 종을 갖는 열경화성 성분 A 및 성분 A가 선택되는 군으로부터의 적어도 하나의 분자로 치환되는 (메트)아크릴레이트, (메트)아크릴아미드, 비닐 에스테르, 비닐 에테르, 비닐, 알릴, 알키닐 또는 스티렌계 화합물 뿐만 아니라 이들의 유도체를 포함하는 군으로부터 선택된 하나 이상의 화학 종을 갖는 광경화성 성분 B를 포함하고, 성분 A의 양은 성분 A 및 B의 총 중량을 기준으로 하여 30 wt% 내지 95 wt%의 범위이고, 광경화성 성분 B의 양은 성분 A 및 B의 총 중량을 기준으로 하여 5 내지 70 wt% 범위이다: JPEGpct00020.jpg2637 A resin composition for three dimensional printing at elevated temperatures forming high temperature-resistant materials, the resin composition comprising a heat curable component A having one or more chemical species chosen from the group comprised of monomers and/or oligomers and/or prepolymers of maleimide derivatives according to formula (I)and a light-curable component B having one or more chemical species chosen from the group comprised of (meth)acrylate, (meth)acrylamide, vinyl esters, vinyl ether, vinyl, allyl, alkinyl or styrenic compounds as well as derivatives thereof substituted with at least one molecule from the group from which component A is chosen, wherein the amount of component A ranges from 30 wt% to 95 wt% based on the total weight of components A and B and the amount of the light-curable component B ranges from 5 to 70 wt%, based on the total weight of components A and B.