Low Dielectric Polyimide Film and Manufacutring Method Thereof

• Main Authors: BACK SUNG YUL, LEE KIL NAM
• Format: Patent
• Language: English; Korean
• Published: 24.05.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention provides a manufacutring method of a low dielectric polyimide film, which comprises the following steps of: preparing a polyamic acid solution; preparing a polyamic acid composition by adding 2 to 3 molar equivalents of a dehydrating agent to the polyamic acid solution; and forming the polyamic acid composition into a film on a support and thermally curing the polyamic acid composition in a heating furnace. 본 발명은 폴리아믹산 용액을 제조하는 단계; 상기 폴리아믹산 용액에 대하여 2~3 몰 당량의 탈수제를 첨가하여 폴리아믹산 조성물을 제조하는 단계; 및 상기 폴리아믹산 조성물을 지지체 상에 제막하고 가열로에서 열경화하는 단계;를 포함하는 저유전 폴리이미드 필름의 제조방법을 제공한다.