SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

One embodiment of the present disclosure provides a semiconductor device. The semiconductor device includes: a semiconductor substrate having first and second surfaces opposite to each other and a side surface positioned between the first and second surfaces and including a device region disposed on...

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Bibliographic Details
Main Authors KANG UN BYOUNG, WON DONG HOON, HEO JUN YEONG
Format Patent
LanguageEnglish
Korean
Published 07.05.2021
Subjects
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