SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
One embodiment of the present disclosure provides a semiconductor device. The semiconductor device includes: a semiconductor substrate having first and second surfaces opposite to each other and a side surface positioned between the first and second surfaces and including a device region disposed on...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
07.05.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!