METHOD FOR PRODUCING POLYIMIDE FILM AND METHOD FOR PRODUCING METAL CLAD LAMINATE

• Main Author: NISHIYAMA TEPPEI
• Format: Patent
• Language: English; Korean
• Published: 07.04.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Provided is a method for preparing a polyimide film that achieves both low CTE and uniformity of the orientation distribution in the thickness direction of the film by a casting method. A polyamide acid containing a diamine residue derived from a diamine component and an acid anhydride residue derived from an acid anhydride component is laminated on a substrate and imidized by heat treatment with an infrared heater, so as to prepare a polyimide film in which a resin component includes a non-thermoplastic polyimide. As for the non-thermoplastic polyimide, the diamine residue derived from a diamine compound represented by formula (1) is 50 parts by mol or more with respect to 100 parts by mol of all diamine residues [In formula (1), a linking group Z represents a single bond or -COO-; Y is independently a monovalent hydrocarbon group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a perfluoroalkyl group having 1 to 3 carbon atoms, or an alkenyl group, which may be substituted with a halogen atom or a phenyl group; n represents an integer of 1 or 2; and p and q independently represent an integer of 0 to 4]. [과제] 캐스트법에 의해, 저CTE화와 필름의 두께 방향의 배향 분포의 균일화를 양립시킨 폴리이미드 필름을 제조하는 방법을 제공한다. [해결수단] 디아민 성분으로부터 유도되는 디아민 잔기와, 산 무수물 성분으로부터 유도되는 산 무수물 잔기를 함유하는 폴리아미드산을 기재 상에 적층하고, 적외선 히터에 의한 열처리에 의해 이미드화하여, 수지 성분이 비열가소성 폴리이미드를 포함하는 폴리이미드 필름을 제조한다. 비열가소성 폴리이미드는, 전체 디아민 잔기 100몰부에 대하여 식 (1)로 표시되는 디아민 화합물로부터 유도되는 디아민 잔기가 50몰부 이상이다. JPEGpat00013.jpg2576 [식 (1)에 있어서, 연결기 Z는 단결합 혹은 -COO-를 나타내고, Y는 독립적으로 할로겐 원자 혹은 페닐기로 치환되어도 되는 탄소수 1 내지 3의 1가의 탄화수소기 또는 탄소수 1 내지 3의 알콕시기, 또는 탄소수 1 내지 3의 퍼플루오로알킬기, 또는 알케닐기를 나타내고, n은 1 또는 2의 정수를 나타내고, p 및 q는 독립적으로 0 내지 4의 정수를 나타낸다]