스퍼터 장치

• Main Authors: WATANABE NAOKI, TAKEI JUNICHI, SUZUKI NAOYUKI, SONE HIROSHI
• Format: Patent
• Language: Korean
• Published: 22.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 개시의 일 양태에 의한 스퍼터 장치는, 기판을 수용하는 처리 용기와, 상기 처리 용기 내의 상기 기판의 상방에 상기 기판의 표면과 평행하게 배치되고, 판 두께 방향으로 관통하는 개구부를 갖는 슬릿판과, 상기 슬릿판에 대하여 경사지게 해서 마련되는 타깃재의 하방에서 상기 슬릿판 상에 적재되고, 상기 슬릿판보다도 내열성이 높은 재료에 의해 형성된 열받이용 플레이트를 갖는다. The sputter device according to one embodiment of the present invention has: a treatment vessel in which a substrate is housed; a slit plate which is disposed above the substrate inside the treatment vessel so as to be located parallel to a surface of the substrate and which has formed therein an opening that penetrates in the plate-thickness direction; and a heat-receiving plate which is formed of a material having a higher heat resistance than the slit plate and which is placed on top of the slit plate beneath a target material provided at a slant with respect the slit plate.