유리 기판에의 도공용 용액

• Main Authors: ECHIGO YOSHIAKI, SUGIMOTO YOSUKE, YAMADA YUKI, YOSHIDA TAKESHI, SHIGETA AKIRA
• Format: Patent
• Language: Korean
• Published: 31.07.2020
• Subjects: ADHESIVES; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; GLASS; INKS; JOINING GLASS TO GLASS OR OTHER MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MINERAL OR SLAG WOOL; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS

본 발명은, 폴리아믹산(PAA) 도막을 열경화할 때, 승온 속도를 빠르게 하더라도 유리 기판에의 밀착성을 충분히 확보할 수 있고, 또한 열경화 후는, 유리 기판으로부터 폴리이미드 필름으로서 용이하게 박리할 수 있는, 보존 안정성이 양호한 도공용 용액을 제공한다. 본 발명은, PAA와 아마이드계 용매와 알콕시실레인 화합물로 이루어지는 유리 기판에의 도공용 용액으로서, 이하를 특징으로 하는 유리 기판에의 도공용 용액에 관한 것이다; 1) 알콕시실레인 화합물의 함유량이, PAA 질량에 대해, 5ppm 초과 100ppm 미만이다; 2) 알콕시실레인 화합물의 분자량이 100 이상 300 이하이다. The present invention provides a coating solution having good storage stability, which can be adhered satisfactorily onto a glass substrate even when the temperature rising rate is increased in the thermal curing of a polyamic acid (PAA) coating film, and which can be thermally cured into a polyimide film that can be detached from the glass substrate easily. The present invention relates to a solution to be coated onto a glass substrate, which contains a PAA, an amide-type solvent and an alkoxysilane compound and is characterized as follows: (1) the content of the alkoxysilane compound is 5 to 100 ppm exclusive relative to the mass of the PAA; and (2) the molecular weight of the alkoxysilane compound is 100 to 300 inclusive.