DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
A manufacturing method of a display device according to an embodiment of the present invention includes the steps of: providing a display substrate on which a plurality of pixels are formed; seating an encapsulation substrate on the display substrate; bonding the display substrate and the encapsulat...
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| Main Author | |
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| Format | Patent |
| Language | English Korean |
| Published |
11.05.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A manufacturing method of a display device according to an embodiment of the present invention includes the steps of: providing a display substrate on which a plurality of pixels are formed; seating an encapsulation substrate on the display substrate; bonding the display substrate and the encapsulation substrate to form a display panel; and forming a module hole through the display panel in the display panel. The step of bonding the display substrate and the encapsulation substrate includes the step of irradiating a microwave pulse laser to a hole region defined as a region surrounding the module hole. As the microwave pulse laser is irradiated, the display substrate and the encapsulation substrate are bonded in the hole region.
본 발명의 실시 예에 따른 표시 장치의 제조 방법은, 복수의 화소들이 형성된 표시 기판을 제공하는 단계, 상기 표시 기판 상에 봉지 기판을 안착하는 단계, 상기 표시 기판 및 상기 봉지 기판을 접합하여 표시 패널을 형성하는 단계, 및 상기 표시 패널에 상기 표시 패널을 관통하는 모듈 홀을 형성하는 단계를 포함하고, 상기 표시 기판 및 상기 봉지 기판을 접합하는 단계는 상기 모듈 홀을 감싸는 영역으로 정의되는 홀 영역에 극초단파 펄스 레이저를 조사하는 단계를 포함하고, 상기 극초단파 펄스 레이저가 조사됨에 따라, 상기 홀 영역에서 상기 표시 기판 및 상기 봉지 기판이 접합된다. |
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| AbstractList | A manufacturing method of a display device according to an embodiment of the present invention includes the steps of: providing a display substrate on which a plurality of pixels are formed; seating an encapsulation substrate on the display substrate; bonding the display substrate and the encapsulation substrate to form a display panel; and forming a module hole through the display panel in the display panel. The step of bonding the display substrate and the encapsulation substrate includes the step of irradiating a microwave pulse laser to a hole region defined as a region surrounding the module hole. As the microwave pulse laser is irradiated, the display substrate and the encapsulation substrate are bonded in the hole region.
본 발명의 실시 예에 따른 표시 장치의 제조 방법은, 복수의 화소들이 형성된 표시 기판을 제공하는 단계, 상기 표시 기판 상에 봉지 기판을 안착하는 단계, 상기 표시 기판 및 상기 봉지 기판을 접합하여 표시 패널을 형성하는 단계, 및 상기 표시 패널에 상기 표시 패널을 관통하는 모듈 홀을 형성하는 단계를 포함하고, 상기 표시 기판 및 상기 봉지 기판을 접합하는 단계는 상기 모듈 홀을 감싸는 영역으로 정의되는 홀 영역에 극초단파 펄스 레이저를 조사하는 단계를 포함하고, 상기 극초단파 펄스 레이저가 조사됨에 따라, 상기 홀 영역에서 상기 표시 기판 및 상기 봉지 기판이 접합된다. |
| Author | SEO WOOSUK |
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| RelatedCompanies | SAMSUNG DISPLAY CO., LTD |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME |
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