Variable resistance memory Device and method of forming the same

According to embodiments of the present invention, a method of manufacturing a variable resistance memory device comprises the steps of: forming an array of memory cells on a substrate, each memory cell including a variable resistance structure and a switching element; and forming a sidewall insulat...

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Main Authors KIM JONGUK, CHOI DONGSUNG, KIM BYONGJU, KO YOUNG MIN, JUNG JAEHO
Format Patent
LanguageEnglish
Korean
Published 17.04.2020
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Abstract According to embodiments of the present invention, a method of manufacturing a variable resistance memory device comprises the steps of: forming an array of memory cells on a substrate, each memory cell including a variable resistance structure and a switching element; and forming a sidewall insulating layer covering a sidewall of the switching element. The forming the sidewall insulating layer includes: a main step of performing multiple times of supplying a silicon source and supplying a reactive gas in one cycle; and a preliminary step of supplying the silicon source to an exposed sidewall of the switching element before the main step. A time duration to supply the silicon source in the preliminary step is longer than one cycle in the main step. 본 발명의 실시예들에 따른 가변 저항 메모리 소자의 제조 방법은 기판 상에 2차원적으로 배열되고 각각 가변 저항 구조체 및 스위칭 소자를 포함하는 메모리 셀들의 어레이를 형성하는 것 및 상기 스위칭 소자의 측벽을 덮는 측벽 절연막을 형성하는 것을 포함한다. 상기 측벽 절연막을 형성하는 것은 실리콘 소스 공급 및 반응 가스 공급을 하나의 사이클로 하여 복수 회 수행하는 메인 단계 및 상기 메인 단계의 시작 이전에, 노출된 상기 스위칭 소자의 측벽에 상기 실리콘 소스를 공급하는 예비 단계를 포함한다. 상기 예비 단계의 상기 실리콘 소스의 공급 시간은 상기 메인 단계의 한 사이클보다 길다.
AbstractList According to embodiments of the present invention, a method of manufacturing a variable resistance memory device comprises the steps of: forming an array of memory cells on a substrate, each memory cell including a variable resistance structure and a switching element; and forming a sidewall insulating layer covering a sidewall of the switching element. The forming the sidewall insulating layer includes: a main step of performing multiple times of supplying a silicon source and supplying a reactive gas in one cycle; and a preliminary step of supplying the silicon source to an exposed sidewall of the switching element before the main step. A time duration to supply the silicon source in the preliminary step is longer than one cycle in the main step. 본 발명의 실시예들에 따른 가변 저항 메모리 소자의 제조 방법은 기판 상에 2차원적으로 배열되고 각각 가변 저항 구조체 및 스위칭 소자를 포함하는 메모리 셀들의 어레이를 형성하는 것 및 상기 스위칭 소자의 측벽을 덮는 측벽 절연막을 형성하는 것을 포함한다. 상기 측벽 절연막을 형성하는 것은 실리콘 소스 공급 및 반응 가스 공급을 하나의 사이클로 하여 복수 회 수행하는 메인 단계 및 상기 메인 단계의 시작 이전에, 노출된 상기 스위칭 소자의 측벽에 상기 실리콘 소스를 공급하는 예비 단계를 포함한다. 상기 예비 단계의 상기 실리콘 소스의 공급 시간은 상기 메인 단계의 한 사이클보다 길다.
Author KO YOUNG MIN
CHOI DONGSUNG
KIM JONGUK
KIM BYONGJU
JUNG JAEHO
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Snippet According to embodiments of the present invention, a method of manufacturing a variable resistance memory device comprises the steps of: forming an array of...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Variable resistance memory Device and method of forming the same
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