METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

One of objectives of the present invention is to provide a method for manufacturing a semiconductor device with reduced defects in characteristics of the semiconductor device due to cracks. By providing a crack inhibiting layer around a portion where a semiconductor element is formed, generation of...

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Bibliographic Details
Main Author CHIDA AKIHIRO
Format Patent
LanguageEnglish
Korean
Published 19.02.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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