SPUTTERING DEVICE

• Main Authors: TAKEI JUNICHI, ORIMOTO SHINJI, SUZUKI NAOYUKI, SONE HIROSHI
• Format: Patent
• Language: English; Korean
• Published: 06.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Provided is a technique for easily changing the shape of an opening. A sputtering device according to one aspect of the present disclosure includes: a processing container that accommodates a substrate; and a slit plate partitioning the processing container into a first space where a target material is installed and a second space where the substrate is installed. The slit plate includes an inner member having an opening penetrating in the thickness direction of the plate; and an outer member provided around the inner member. The inner member is detachable from the outer member. 개구부의 형상을 용이하게 변경할 수 있는 기술을 제공한다. 본 개시의 일 태양에 의한 스퍼터링 장치는, 기판을 수용하는 처리 용기와, 상기 처리 용기 내를 타겟재가 설치되는 제 1 공간과 상기 기판이 설치되는 제 2 공간으로 구획하는 슬릿판을 포함하며, 상기 슬릿판은, 판두께 방향으로 관통하는 개구부를 갖는 내측 부재와, 상기 내측 부재의 주위에 설치되는 외측 부재를 구비하며, 상기 내측 부재는 상기 외측 부재에 대해서 착탈 가능하다.