LIGHT EMITTING DEVICE PACKAGE AND LIGHT MODULE
According to an embodiment of the present invention, provided is a light emitting element package capable of effectively emitting heat which is emitted from a light emitting element. The light emitting element package comprises: a body including a through hole passing through an upper surface and a...
Saved in:
| Main Authors | , , |
|---|---|
| Format | Patent |
| Language | English Korean |
| Published |
10.12.2019
|
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | According to an embodiment of the present invention, provided is a light emitting element package capable of effectively emitting heat which is emitted from a light emitting element. The light emitting element package comprises: a body including a through hole passing through an upper surface and a lower surface; a light emitting element including first and second bonding units arranged on the upper surface of the body and spaced apart from each other; and first and second metal units arranged to be spaced apart from each other on a rear surface of the body. A partial region of each of the first and second bonding units overlaps the through hole in a vertical direction. Each of the first and second metal units includes first and second extension units extended to the through hole, respectively. Each of the first and second extension units is electrically connected with the first and second bonding units, respectively. The first and second extension units face each other in the through hole.
실시예에 따른 발광소자 패키지는 상면 및 하면을 관통하는 관통홀을 포함하는 몸체, 상기 몸체의 상면 상에 배치되며 서로 이격되는 제 1 및 제 2 본딩부를 포함하는 발광소자 및 상기 몸체의 배면 상에 서로 이격되어 배치되는 제 1 및 제 2 금속부를 포함하고, 상기 제 1 및 제 2 본딩부 각각의 일부 영역은, 상기 관통홀과 수직 방향으로 중첩되고, 상기 제 1 및 제 2 금속부 각각은 상기 관통홀로 연장되는 제 1 및 제 2 연장부를 각각 포함하고, 상기 제 1 및 제 2 연장부 각각은 상기 제 1 및 제 2 본딩부와 각각 전기적으로 연결되고, 상기 제 1 및 제 2 연장부는 상기 관통홀 내에서 서로 마주한다. |
|---|---|
| AbstractList | According to an embodiment of the present invention, provided is a light emitting element package capable of effectively emitting heat which is emitted from a light emitting element. The light emitting element package comprises: a body including a through hole passing through an upper surface and a lower surface; a light emitting element including first and second bonding units arranged on the upper surface of the body and spaced apart from each other; and first and second metal units arranged to be spaced apart from each other on a rear surface of the body. A partial region of each of the first and second bonding units overlaps the through hole in a vertical direction. Each of the first and second metal units includes first and second extension units extended to the through hole, respectively. Each of the first and second extension units is electrically connected with the first and second bonding units, respectively. The first and second extension units face each other in the through hole.
실시예에 따른 발광소자 패키지는 상면 및 하면을 관통하는 관통홀을 포함하는 몸체, 상기 몸체의 상면 상에 배치되며 서로 이격되는 제 1 및 제 2 본딩부를 포함하는 발광소자 및 상기 몸체의 배면 상에 서로 이격되어 배치되는 제 1 및 제 2 금속부를 포함하고, 상기 제 1 및 제 2 본딩부 각각의 일부 영역은, 상기 관통홀과 수직 방향으로 중첩되고, 상기 제 1 및 제 2 금속부 각각은 상기 관통홀로 연장되는 제 1 및 제 2 연장부를 각각 포함하고, 상기 제 1 및 제 2 연장부 각각은 상기 제 1 및 제 2 본딩부와 각각 전기적으로 연결되고, 상기 제 1 및 제 2 연장부는 상기 관통홀 내에서 서로 마주한다. |
| Author | KIM KI SEOK LIM CHANG MAN KIM WON JUNG |
| Author_xml | – fullname: KIM KI SEOK – fullname: KIM WON JUNG – fullname: LIM CHANG MAN |
| BookMark | eNrjYmDJy89L5WTQ8_F09whRcPX1DAnx9HNXcHEN83R2VQhwdPZ2dHdVcPRzUYCo8PV3CfVx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGlgaGxmaG5kaOxsSpAgBJDCf1 |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | 발광소자 패키지 및 광원 모듈 |
| ExternalDocumentID | KR20190136172A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_KR20190136172A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 14:40:36 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English Korean |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_KR20190136172A3 |
| Notes | Application Number: KR20180061494 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&CC=KR&NR=20190136172A |
| ParticipantIDs | epo_espacenet_KR20190136172A |
| PublicationCentury | 2000 |
| PublicationDate | 20191210 |
| PublicationDateYYYYMMDD | 2019-12-10 |
| PublicationDate_xml | – month: 12 year: 2019 text: 20191210 day: 10 |
| PublicationDecade | 2010 |
| PublicationYear | 2019 |
| RelatedCompanies | LG INNOTEK CO., LTD |
| RelatedCompanies_xml | – name: LG INNOTEK CO., LTD |
| Score | 3.1983497 |
| Snippet | According to an embodiment of the present invention, provided is a light emitting element package capable of effectively emitting heat which is emitted from a... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | LIGHT EMITTING DEVICE PACKAGE AND LIGHT MODULE |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&locale=&CC=KR&NR=20190136172A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDLbGQMANBojHQJVAvRWyPvY4VKhLurZ0fWjqpt2mtmQSAnUTK-Lv44YNdtotiSPnITn2l9gOwEPK2z2Nz3XFmGeGohuEKKnWJQpRedrVW3M161TRyEHYdsf6y9SY1uBjEwsj8oR-i-SIKFE5ynspzuvl_yUWE76Vq6fsDZsWz4PEZPIaHSP4QAgjs75pxxGLqEyp6Y_kcCRoVXoy1NfWHuyjId0RsG3Sr-JSlttKZXACBzHyK8pTqL0vGnBEN3-vNeAwWD95Y3EtfaszeBx6jptIuHNJ4oWOxOyJR20ptqhvObZkhUz67RFEbDy0z-F-YCfUVXDg2d86Z_5oe5baBdSLRcEvQdI0rZejpZDnaqYj5EhV3uFoGaDtkZKcvF5Bcxen693kGziuqpWPRos0oV5-fvFb1LRldic26AflrXtZ |
| link.rule.ids | 230,309,783,888,25577,76883 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvFNUeMH6hLN3qZlH3w8EDPawea-CBmEt2WbJTGaQWTGf99bBeWJt6bXXNtLrne_9u4K8JDwVlfjc10x5qmh6AYhSqJ1iEJUnnT05lxN22U2sh-07In-MjNmFfjY5MKIOqHfojgialSG-l6I83r5f4nFRGzl6il9w67F8yDqMXmNjhF8IISRWb9njUIWUpnSnjuWg7GgleXJ0F6be7CPTnZHgKVpv8xLWW4blcExHIyQX16cQOV9UYca3fy9VodDf_3kjc219q1O4dFzhnYkoeSiyAmGErOmDrWkkUldc2hJZsCk3xF-yCaedQb3AyuitoITx3_7jN3x9iq1c6jmi5xfgKRpWjdDTyHL1FRHyJGovM3RM0DfIyEZeb2Exi5OV7vJd1CzI9-LPSdwr-GoJJXxGk3SgGrx-cVv0OoW6a0Q1g_WT35J |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=LIGHT+EMITTING+DEVICE+PACKAGE+AND+LIGHT+MODULE&rft.inventor=KIM+KI+SEOK&rft.inventor=KIM+WON+JUNG&rft.inventor=LIM+CHANG+MAN&rft.date=2019-12-10&rft.externalDBID=A&rft.externalDocID=KR20190136172A |