Chip pick-up apparatus

The present invention discloses a component pick-up device. The present invention includes a component pick-up part comprising a plurality of nozzle parts for adsorbing and moving a component, a light emitting part which is disposed on the component pick-up part and emits light to the plurality of n...

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Bibliographic Details
Main Authors YOON EUN SUK, BAN JONG EOK, JO SUNG HO, KIM BYUNG JU
Format Patent
LanguageEnglish
Korean
Published 19.11.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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