패터닝 애플리케이션들을 위한 선택적 증착을 위한 방식들

• Main Authors: BASU ATASHI, MALLICK ABHIJIT BASU
• Format: Patent
• Language: Korean
• Published: 04.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

제2 기판 표면에 비해 제1 기판 표면 상에 막을 선택적으로 증착하는 방법들이 설명된다. 방법들은, 유전체를 보호하지 않으면서 제1 금속 상에 제2 금속을 증착하는 단계; 가교 자기-조립 단분자층으로 금속을 보호하는 단계; 및 금속이 보호되는 동안 제1 유전체 상에 제2 유전체를 증착하는 단계를 포함한다. Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface are described. The methods include depositing a second metal on a first metal without protecting the dielectric, protecting the metal with a cross-linked self-assembled monolayer and depositing a second dielectric on the first dielectric while the metal is protected.