EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME

• Main Authors: YOON JI AH, KIM JUNG HWA, CHO JI YOON, PARK YONG YEOP, BAE KYOUNG CHUL, KIM SO YOON, LEE DONG HWAN
• Format: Patent
• Language: English; Korean
• Published: 09.07.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

An epoxy resin composition for encapsulating a semiconductor device of the present invention comprises an epoxy resin, a hardener, an inorganic filler and an explosion inhibitor. The inorganic filler comprises a first inorganic filler containing a barium-titanium-yttrium oxide represented by chemical formula 1. The epoxy resin composition for encapsulating a semiconductor device of the present invention has high specific inductive capacity, high thermal conductivity, a low moisture absorption ratio and an excellent fingerprint recognition rate. In addition, the change of specific inductive capacity changes little with the temperature. 본 발명의 반도체 소자 밀봉용 에폭시 수지 조성물은 에폭시 수지, 경화제, 무기 충전제 및 폭발 방지제를 포함하고, 상기 무기 충전제는 화학식 1로 표시되는 바륨-티타늄-이트륨 산화물을 포함하는 제1 무기 충전제를 포함한다.