EPOXY RESIN VARNISH COMPOSITION AND FILM USING THE SAME FOR ENCAPSULATING SEMICOMDUCTOR DEVICE

• Main Authors: LEE YOON MAN, KIM JUNG SEOB, LEE JUN WOO
• Format: Patent
• Language: English; Korean
• Published: 09.07.2019
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

The present invention relates to a varnish composition for encapsulating a semiconductor element, which comprises: an epoxy resin; a curing agent; an inorganic filler; and a solvent and satisfies formula 1, 6 <= TI = viscosity at 0.6 rpm/viscosity at 6.0 rpm <= 9, to a film for encapsulating a semiconductor element produced using the same, and to a semiconductor device encapsulated using the same. The film for encapsulating a semiconductor element exhibits excellent performance when applied for encapsulating a semiconductor element due to excellent dispersibility of the inorganic filler. 에폭시 수지; 경화제; 무기 충전제; 및 용매를 포함하고, 식 1을 만족하는 반도체 소자 밀봉용 필름 제조용 바니시 조성물, 이를 이용하여 제조된 반도체 소자 밀봉용 필름 및 이를 이용하여 밀봉된 반도체 장치에 관한 것이다.