COMPOSITION FOR FORMING CURED FILM AND METHOD FOR FORMING CURED FILM

• Main Authors: TAMURA KOKI, TAKEUCHI HIROAKI
• Format: Patent
• Language: English; Korean
• Published: 08.07.2019
• Subjects: ADHESIVES; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention relates to a composition for forming a cured film, which comprises an epoxy compound (A) and hollow silica (B), wherein the epoxy compound (A) and the hollow silica (B) can form the cured film while suppressing a problem of surfaces, even if forming a coating film using a slit coating method or the like which are easy to cause surface problems, such as blur nonuniformity, stripe nonuniformity, and a pin mark, and to a method for forming a cured film using the composition for forming a cured film. When forming the cured film using the composition containing the epoxy compound (A), the hollow silica (B), and a solvent (S), a surfactant (C) is added to the composition, and as the solvent (S), at least one high boiling point solvent (SH) having a boiling point of 170°C or higher under atmospheric pressure is used. (과제) 흐림 불균일, 줄무늬 불균일, 핀 자국과 같은 표면의 문제가 발생하기 쉬운 슬릿 도포법 등을 사용하여 도포막을 형성해도, 이들 표면의 문제를 억제하면서, 경화막을 형성할 수 있는, 에폭시 화합물 (A) 과, 중공 실리카 (B) 를 포함하는 경화막 형성용 조성물과, 당해 경화막 형성용 조성물을 사용하는 경화막 형성 방법을 제공하는 것. (해결 수단) 에폭시 화합물 (A) 과, 중공 실리카 (B) 와, 용제 (S) 를 포함하는 조성물을 사용하여 경화막을 형성할 때에, 조성물에 계면 활성제 (C) 를 첨가하고, 또한 용제 (S) 로서 대기압 하에서의 비점이 170 ℃ 이상인 1 종 이상의 고비점 용제 (SH) 를 사용한다.