Apparatus for Forming Sample
According to one embodiment of the present invention, a device for processing a sample comprises: a fixing means configured so as to fix a sample; a polishing means configured so as to polish the sample fixed to the fixing means; and a position changing means configured so as to move the fixing mean...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
28.06.2019
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Subjects | |
Online Access | Get full text |
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Abstract | According to one embodiment of the present invention, a device for processing a sample comprises: a fixing means configured so as to fix a sample; a polishing means configured so as to polish the sample fixed to the fixing means; and a position changing means configured so as to move the fixing means in at least three directions such that a contact surface of the sample with the polishing means can be changed. Therefore, an objective of the present invention is to provide the device for processing a sample wherein a worker can easily collect a crack occurring position of the sample.
본 발명의 일 실시 예에 따른 시편 가공 장치는 시편을 고정하도록 구성되는 고정수단; 상기 고정수단에 고정된 시편을 연마하도록 구성되는 연마수단; 및 시편과 상기 연마수단의 접촉면이 변경되도록 상기 고정수단을 적어도 3 방향으로 이동시키도록 구성되는 위치변경수단;을 포함한다. |
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AbstractList | According to one embodiment of the present invention, a device for processing a sample comprises: a fixing means configured so as to fix a sample; a polishing means configured so as to polish the sample fixed to the fixing means; and a position changing means configured so as to move the fixing means in at least three directions such that a contact surface of the sample with the polishing means can be changed. Therefore, an objective of the present invention is to provide the device for processing a sample wherein a worker can easily collect a crack occurring position of the sample.
본 발명의 일 실시 예에 따른 시편 가공 장치는 시편을 고정하도록 구성되는 고정수단; 상기 고정수단에 고정된 시편을 연마하도록 구성되는 연마수단; 및 시편과 상기 연마수단의 접촉면이 변경되도록 상기 고정수단을 적어도 3 방향으로 이동시키도록 구성되는 위치변경수단;을 포함한다. |
Author | PARK YOEN JUNG KOH SEONG UNG |
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DocumentTitleAlternate | 시편 가공 장치 |
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Snippet | According to one embodiment of the present invention, a device for processing a sample comprises: a fixing means configured so as to fix a sample; a polishing... |
SourceID | epo |
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SubjectTerms | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING PERFORMING OPERATIONS PHYSICS POLISHING TESTING TRANSPORTING |
Title | Apparatus for Forming Sample |
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