CONTACT FORMATION METHOD AND RELATED STRUCTURE

Disclosed are a method for forming a via-first metal gate contact and a structure thereof. The method includes a step of depositing a first dielectric layer over a substrate having a gate structure with a metal gate layer. An opening is formed within the first dielectric layer to expose a portion of...

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Bibliographic Details
Main Authors WANG MEI YUN, CHAO KUO YI, WANG CHAO HSUN, HSUEH WANG JUNG
Format Patent
LanguageEnglish
Korean
Published 10.06.2019
Subjects
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