CONTACT FORMATION METHOD AND RELATED STRUCTURE
Disclosed are a method for forming a via-first metal gate contact and a structure thereof. The method includes a step of depositing a first dielectric layer over a substrate having a gate structure with a metal gate layer. An opening is formed within the first dielectric layer to expose a portion of...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
10.06.2019
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Subjects | |
Online Access | Get full text |
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