기판, 기판 홀더, 기판 코팅 장치, 기판 코팅 방법 및 코팅 제거 방법

• Main Authors: LIEDECKE CHRISTIAN, WELTERS WILHELMUS JACOBUS JOHANNES, SOETHOUDT ABRAHAM ALEXANDER, KAMMINGA JELMER MATTHEUES, ACHANTA SATISH
• Format: Patent
• Language: Korean
• Published: 07.05.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CINEMATOGRAPHY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MATERIALS THEREFOR; METALLURGY; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 발명은 기판(100), 기판 홀더(200),기판 코팅 장치(800, 801), 기판(100)을 코팅하기 위한 방법, 및 코팅(102)을 제거하기 위한 방법에 관한 것이다. 기판의 배면(101) 또는 기판 홀더(200)의 클램프 표면(202)에 단분자 층(102)이 가해진다. 기판 배면과 기판 사이의 마찰력은, 기판이 전체 클램핑력(210)을 받지 않을 때 작다. 기판(100)을 기판 홀더(200)에 로딩한 후에, 기판을 고정하기 위해 전체 클램핑력(210)이 가해진다. 클램핑력에 의해 단분자 층(102)의 국부적인 제거가 일어나고, 그래서, 기판(100)과 기판 홀더(200) 사이의 마찰력이 증가 된다. The present invention relates to a substrate (100), a substrate holder (200), a substrate coating apparatus (800. 801), a method for coating the substrate (100) and a method for removing the coating (102. Clamping of a substrate (100) often results in substrate deformation. This is caused by friction forces (104) between the substrate (100) and the substrate holder (200). These forces (104) result in significant stress components causing translation of features on the substrate. The friction forces need however to be sufficiently large to keep the substrate firmly attached to the substrate holder during the lithographic process. This dual character of the friction forces poses a problem. This problem is solved by applying a monomolecular layer (102) to the backside (101) of the substrate or a clamp surface (201) of the substrate holder (200). The friction force between the substrate backside and the substrate is small when the substrate does not experience full clamping force (210). This allows a stress-free relaxation of the substrate (100). After loading the substrate (100) on the substrate holder (200) full clamping force (210) is exerted in order to fix the substrate with respect to the substrate holder. The clamping force causes local removal of the monomolecular layer (102), resulting in a direct contact (205) between the substrate backside (101) and the clamp surface (201) of the substrate holder. This direct contact results in a strong increase of the friction force between the substrate (100) and the substrate holder (200).