IMAGING MODULE FOR SUPPORTING PRINTED CIRCUIT BOARDS IN A PREDETERMINED ANGULAR RELATIONSHIP INSIDE AN IMAGING READER AND METHOD OF ASSEMBLY
An imaging module for reading targets by image capture is mounted as a unitary assembly within an imaging reader. An imager is mounted on a first printed circuit board (PCB), and an interface connector is mounted on a second PCB. The first PCB is in direct superficial contact with first chassis wall...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Korean |
Published |
27.12.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An imaging module for reading targets by image capture is mounted as a unitary assembly within an imaging reader. An imager is mounted on a first printed circuit board (PCB), and an interface connector is mounted on a second PCB. The first PCB is in direct superficial contact with first chassis walls of a chassis and is positioned to lie in a generally upright first predetermined plane. The second PCB is in direct superficial contact with second chassis walls of the chassis and is positioned to lie in a generally tilted second predetermined plane which is inclined at a tilt angle relative to the first predetermined plane. The first and second chassis walls are constituted as a one-piece support which maintains a tilt angle between the PCBs.
이미지 캡처에 의해 타겟들을 판독하기 위한 촬상 모듈이 촬상 판독기 내에 단일 조립체로서 탑재된다. 촬상기가 제1 PCB(printed circuit board) 상에 탑재되고, 인터페이스 커넥터가 제2 PCB 상에 탑재된다. 제1 PCB는 섀시의 제1 섀시 벽들과 직접적인 표면적 접촉을 이루고, 일반적으로 직립인 제1 미리 결정된 평면 내에 놓이도록 배치된다. 제2 PCB는 섀시의 제2 섀시 벽들과 직접적인 표면적 접촉을 이루고, 제1 미리 결정된 평면에 대해 경사각으로 기울어진 일반적으로 경사진 제2 미리 결정된 평면 내에 놓이도록 배치된다. 제1 및 제2 섀시 벽들은 PCB들 사이의 경사각을 유지하는 일체형 지지체로서 구성된다. |
---|---|
Bibliography: | Application Number: KR20180164154 |