동장 적층판 및 그 제조 방법

• Main Authors: OOGAMI HIROYUKI, ORITA TAKAHIRO, UENO YASUTSUGU, FURUKAWA KOUTARO, IWAISAKO YASUSHI
• Format: Patent
• Language: Korean
• Published: 27.11.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

본 발명은 가시광 및 자외광에 대해 높은 반사율을 가지며, 자외광 내성이나 내열성이 우수한 동장 적층판을 제공한다. 본 발명에서는, 동장 적층판을, 구리층, 백색층, 접착층 및 열전도율이 200W/m·K 이상인 고열전도 기판을 이 순서로 가지며, 백색층을 자외광 내성이 높은 오르가노폴리실록산의 매트릭스 중에 자외광 반사율이 높은 BN, ZrO, SiO, CaF, 다이아몬드 중 어느 하나의 필러를 갖는 조성으로 하고, 백색층과 고열전도 기판을 열경화성 수지로 접합한 구조로 하였다. The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.