PROCESSING METHOD
An objective of the present invention is to provide a processing method capable of increasing speed of processing while maintaining processing quality when a plate-shaped workpiece formed by stacking laminates including metal on a line to be cut is processed. The processing method comprises: a holdi...
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| Main Author | |
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| Format | Patent |
| Language | English Korean |
| Published |
12.10.2018
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An objective of the present invention is to provide a processing method capable of increasing speed of processing while maintaining processing quality when a plate-shaped workpiece formed by stacking laminates including metal on a line to be cut is processed. The processing method comprises: a holding step of holding a workpiece in a holding table; and a cutting step of cutting the workpiece with an annular cutting blade along the line to be cut after the holding step is performed. The cutting blade has a slit opening at the outside edge. In the cutting step, the cutting is performed while supplying a cutting fluid containing organic acid and an oxidizing agent to the workpiece.
본 발명은, 금속을 포함하는 적층체가 절단 예정 라인에 겹쳐 형성된 판형의 피가공물을 가공할 때에, 가공의 품질을 유지하면서 가공의 속도를 높일 수 있는 가공 방법을 제공하는 것을 목적으로 한다. 금속을 포함하는 적층체가 절단 예정 라인에 겹쳐 형성된 판형의 피가공물을 가공하는 가공 방법으로서, 피가공물을 유지 테이블로 유지하는 유지 단계와, 유지 단계를 실시한 후, 절단 예정 라인을 따라 환형의 절삭 블레이드로 피가공물을 절삭하여 적층체를 분단하는 절삭 단계를 구비하고, 절삭 블레이드는, 외주 가장자리에 개구되는 슬릿을 가지며, 절삭 단계에서는, 유기산과 산화제를 포함하는 절삭액을 피가공물에 공급하면서 절삭을 수행한다. |
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| AbstractList | An objective of the present invention is to provide a processing method capable of increasing speed of processing while maintaining processing quality when a plate-shaped workpiece formed by stacking laminates including metal on a line to be cut is processed. The processing method comprises: a holding step of holding a workpiece in a holding table; and a cutting step of cutting the workpiece with an annular cutting blade along the line to be cut after the holding step is performed. The cutting blade has a slit opening at the outside edge. In the cutting step, the cutting is performed while supplying a cutting fluid containing organic acid and an oxidizing agent to the workpiece.
본 발명은, 금속을 포함하는 적층체가 절단 예정 라인에 겹쳐 형성된 판형의 피가공물을 가공할 때에, 가공의 품질을 유지하면서 가공의 속도를 높일 수 있는 가공 방법을 제공하는 것을 목적으로 한다. 금속을 포함하는 적층체가 절단 예정 라인에 겹쳐 형성된 판형의 피가공물을 가공하는 가공 방법으로서, 피가공물을 유지 테이블로 유지하는 유지 단계와, 유지 단계를 실시한 후, 절단 예정 라인을 따라 환형의 절삭 블레이드로 피가공물을 절삭하여 적층체를 분단하는 절삭 단계를 구비하고, 절삭 블레이드는, 외주 가장자리에 개구되는 슬릿을 가지며, 절삭 단계에서는, 유기산과 산화제를 포함하는 절삭액을 피가공물에 공급하면서 절삭을 수행한다. |
| Author | TAKENOUCHI KENJI |
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| Notes | Application Number: KR20180035945 |
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| RelatedCompanies | DISCO CORPORATION |
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| Snippet | An objective of the present invention is to provide a processing method capable of increasing speed of processing while maintaining processing quality when a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | PROCESSING METHOD |
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