래핑재 및 그 제조 방법과, 연마물의 제조 방법

경편 또는 위편으로 구성된 편지와, 상기 편지에 함침된 수지를 갖는 래핑재. A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.

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Main Authors KASHIWADA HIROSHI, KOIKE KENICHI, TOKUSHIGE SHIN, NAKASE KEISUKE, KURIHARA HIROSHI
Format Patent
LanguageKorean
Published 04.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

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Abstract 경편 또는 위편으로 구성된 편지와, 상기 편지에 함침된 수지를 갖는 래핑재. A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.
AbstractList 경편 또는 위편으로 구성된 편지와, 상기 편지에 함침된 수지를 갖는 래핑재. A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.
Author KURIHARA HIROSHI
KOIKE KENICHI
TOKUSHIGE SHIN
KASHIWADA HIROSHI
NAKASE KEISUKE
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Snippet 경편 또는 위편으로 구성된 편지와, 상기 편지에 함침된 수지를 갖는 래핑재. A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the...
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SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Title 래핑재 및 그 제조 방법과, 연마물의 제조 방법
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