EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICOMDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED BY USING THE SAME

• Main Authors: YOON, JI AH, PARK, YONG YEUP, LEE, DONG HWAN, CHO, JI YOON, KIM, YOUNG HO
• Format: Patent
• Language: English; Korean
• Published: 27.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides an epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by using the composition, wherein the composition comprises an epoxy resin, a curing agent, an inorganic filler and a curing catalyst containing a phosphonium-based compound represented by chemical formula 1. The epoxy resin composition for encapsulating the semiconductor device has excellent crack resistance and alleviates wire sweep phenomenon. 본 발명은 본 발명은 에폭시 수지, 경화제, 무기 충전제 및 화학식 1로 표시되는 포스포늄계 화합물을 포함하는 경화 촉매를 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자를 제공한다. 상기 반도체 소자 밀봉용 에폭시 수지 조성물은 우수한 내크랙성을 가지며, 와이어 스윕(wire sweep) 현상이 개선된 것이다.