LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

• Main Authors: UCHIYAMA NAOKI, WAKUDA TOSHIMITSU, FUKUYO FUMITSUGU, FUKUMITSU KENSHI
• Format: Patent
• Language: English; Korean
• Published: 25.04.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

본 발명은 가공 대상물의 표면에 용융이나 절단 예정 라인으로부터 벗어난 갈라짐이 생기지 않고 가공 대상물을 절단할 수 있는 절단방법, 가공대상물 절단방법 및 광투과성 재료 절단방법을 제공한다. 다광자 흡수를 일으키게 하는 조건으로 또한 가공 대상물(1)의 내부에 집광점(P)을 맞추어, 펄스 레이저 광(L)을 가공 대상물(1)의 표면(3)의 절단 예정 라인(5)에 조사하고 있다. 집광점(P)을 절단 예정 라인(5)에 따라 이동시킴으로써, 개질 영역을 절단 예정 라인(5)에 따르도록 가공 대상물(1)의 내부에 형성하고 있다. 개질 영역...