THERMOSETTING RESIN COMPOSITION AND PRODUCING METHOD OF THE SAME

• Main Authors: LEE, JONG HUN, PARK, IN SUNG, KANG, GIL HO, JI, SEUNG WOOK, KIM, MYEONG HEE, BAE, SUNG JAE, PARK, GUN PYO
• Format: Patent
• Language: English; Korean
• Published: 23.04.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention provides a thermosetting resin composition comprising a crosslinker which is represented by chemical formula 1, chemical formula 2, or chemical formula 3, and a method of preparing the same. In the chemical formulas 1 to 3: R^1 and R^2 are each independently a group located at an ortho- or para- position and may be each independently a hydroxyl group, an alkoxy group having 1-10 carbon atoms, or an alkyl group having 1-10 carbon atoms. 하기 화학식 1, 하기 화학식 2 또는 하기 화학식 3으로 표시되는 가교제를 포함하는 열경화성 수지 조성물 및 이의 제조방법을 제공한다: [화학식 1][화학식 2][화학식 3]상기 화학식 1 내지 3에서, 상기 R및 R는 각각 독립적으로, 오르소(ortho-) 또는 파라(para-) 위치에 존재하는 기로서, 히드록시기, 탄소수 1개 내지 10개의 알콕시기, 또는 탄소수 1개 내지 10개의 알킬기이다.