SHIELDING COATING FOR SELECTIVE METALLIZATION

• Main Authors: KWOK WAI YEE, KA MING YIP, CHIT YIU CHAN, HUNG TAT CHAN
• Format: Patent
• Language: English; Korean
• Published: 21.03.2018
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to shielding coating for selective metallization. The shielding coating is applied to a polymer substrate for selective metallization of a substrate. The shielding coating comprises a primer component and a hydrophobic topcoat. The primer is first applied to the polymer substrate followed by application of a topcoat component. The shield coating is then selectively etched to form an outline of a desired current pattern. The catalyst is applied to the patterned polymer substrate followed by electroless metal plating on the etched part. A part of the polymer substrate containing the shielding coating inhibits the electroless metal plating. The primer contains an aromatic heterocyclic compound and the top coat contains a hydrophobic alkyl organic compound. 차폐 코팅은 기판의 선택적 금속화를 위해 폴리머 기판에 적용된다. 차폐 코팅은 프라이머 성분 및 소수성 탑 코트를 포함한다. 프라이머가 먼저 폴리머 기판에 적용되고 그 다음 탑 코트 성분의 적용이 따른다. 차폐 코팅은 그런 다음 목적 전류 패턴의 윤곽을 형성하기 위해 선택적으로 에칭된다. 촉매가 패턴화된 폴리머 기판에 적용되고 그 다음 에칭된 부분에 무전해 금속 도금이 따른다. 차폐 코팅을 함유하는 폴리머 기판의 부분은 무전해 금속 도금을 저해한다. 프라이머는 방향족 헤테로환계 화합물을 함유하고 탑 코트는 소수성 알킬 유기 화합물을 함유한다.