CLEANING BLADE AND IMAGE FORMING APPARATUS

The present invention provides a cleaning blade configured to contact a cleaning target member to clean a surface of the cleaning target member. The cleaning blade has a contact surface configured to contact a cleaning target member. A Young′s modulus of the cleaning blade becomes the maximum value...

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Bibliographic Details
Main Author YOSHITOKU DAISUKE
Format Patent
LanguageEnglish
Korean
Published 09.03.2018
Subjects
CINEMATOGRAPHY
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
MAGNETOGRAPHY
PHOTOGRAPHY
PHYSICS
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Summary:The present invention provides a cleaning blade configured to contact a cleaning target member to clean a surface of the cleaning target member. The cleaning blade has a contact surface configured to contact a cleaning target member. A Young′s modulus of the cleaning blade becomes the maximum value at the maximum location on an inner side of the contact surface in a thickness direction of the cleaning blade. Relations of Y_m > Y_c > Y_b are maintained wherein Y_c is a value of the Young′s modulus in the contact surface, Y_m is the maximum value of the Young′s modulus at the maximum location, and Y_b is a value of the Young′s modulus at a location remoter from the contact surface than the maximum location in the thickness direction. 본 개시내용은 클리닝 타겟 부재와 접촉하여 클리닝 타겟 부재의 표면을 클리닝하도록 구성된 클리닝 블레이드를 제공한다. 클리닝 블레이드는 클리닝 타겟 부재와 접촉하도록 구성된 접촉면을 가지고, (i) 클리닝 블레이드의 영 계수가 클리닝 블레이드의 두께 방향으로 접촉면의 내측의 극대 위치에서 극대값에 도달하고, (ii) Ym > Yc > Yb의 관계가 유지되도록 형성되며, 여기서, Yc는 접촉면에서의 영 계수의 값이고, Ym은 극대 위치에서의 영 계수의 극대값이고, Yb는 두께 방향으로 극대 위치보다 많이 접촉면으로부터 떨어진 위치에서의 영 계수의 값이다.
Bibliography:Application Number: KR20170107056