Tough polyamide moulding material

• Main Authors: BAUMANN FRANZ ERICH, PEIRICK HEINRICH, BERGER JASMIN
• Format: Patent
• Language: English; Korean
• Published: 21.02.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

A molding material of the present invention is formed of a combination of at least about 50 wt% of the following components: a) 80 to 97 parts by mass of a polyamide component including a1) 70 to 100 parts by weight of PA PACMX (wherein X = 8 to 18) and a2) 30 to 0 part by weight of a linear aliphat...