INKJET PHOTO- AND HEAT-CURABLE ADHESIVE SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ELECTRONIC PART

• Main Authors: INUI OSAMU, FUJITA YUSUKE, INOUE TAKANORI, FUJITA YOSHITO, TAKAHASHI RYOSUKE, TANIKAWA MITSURU, WATANABE TAKASHI, UEDA MICHIHISA
• Format: Patent
• Language: English; Korean
• Published: 11.07.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

접착제가 경화한 접착제층의 두께 정밀도를 높일 수 있고, 또한 접착제층에 보이드를 발생하기 어렵게 할 수 있는 잉크젯용 광 및 열경화성 접착제를 제공한다. 본 발명에 따른 잉크젯용 광 및 열경화성 접착제는, 광경화성 화합물과, 열경화성 화합물과, 광중합 개시제와, 열경화제를 포함하고, 365㎚에서의 조도가 100㎽/㎠가 되도록 적산 광량 1000mJ/㎠의 광을 접착제에 조사해서 B 스테이지화 접착제를 얻었을 때, 상기 B 스테이지화 접착제의 25℃에서의 탄성률이 5.0×10㎩ 이상, 8.0×10㎩ 이하이다. Provided is a photocurable and thermosetting adhesive for inkjet which can increase the thickness accuracy of an adhesive layer formed by curing an adhesive and can further cause the adhesive layer to hardly generate voids. A photocurable and thermosetting adhesive for inkjet according to the present invention contains a photocurable compound, a thermosetting compound, a photopolymerization initiator, and a thermal curing agent, wherein the elastic modulus at 25°C of a B-staged adhesive is at least 5.0 × 10 2 Pa and at most 8.0 0 × 10 4 Pa when the B-staged adhesive is obtained by irradiating the adhesive with light of a cumulative light quantity of 1000 mJ/cm 2 so that illumination at a wavelength of 365 nm is 100 mW/cm 2 .