SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: YODA MITSUO, KOBASHI HIDEHARU, OMORI RYO
• Format: Patent
• Language: English; Korean
• Published: 04.07.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES

반도체 칩(다이)의 표면 상의 이상 검출을 2치화나 양품의 화상 차분법의 방법으로 행하면, 1화소 미만의 폭의 크랙을 찾을 수 없다. 반도체 제조 장치는, 다이를 촬상하는 촬상부와, 다이와 촬상부를 연결하는 선 상에 배치되는 조명부와, 촬상부 및 조명부를 제어하는 제어부를 구비한다. 제어부는, 다이의 외관 검사 시의 조명부의 조사 면적을 다이의 위치 결정시의 조명부의 조사 면적보다도 좁게 하고, 촬상부에서 다이를 촬상한다. The present invention provides a semiconductor manufacturing device, a manufacturing method of a semiconductor device and a die placement machine which solve the problem that the crack having the width less than one pixel can not be discovered when an image difference method between the binarization and the yields is used to detect the anomaly on the surface of a semiconductor chip (a bare chip). The semiconductor manufacturing device comprises a shooting part of shooting the bare chip, an illumination part configured in the connection line of the bare chip and the shooting part and a control part for controlling the shooting part and the illumination part. The control part enables the illumination area of the illumination part when the appearance of the bare chip is examined to be smaller than the illumination area of the illumination part when the bare chip is positioned, and the shooting part is utilized to shoot the bare chip.