HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER

데이터 링크는 링크의 초기화 동안 적응된다. 링크의 적응은, 원격 에이전트로부터 의사난수 이진 시퀀스(PRBS)를 수신하는 것, 데이터 링크의 특성을 식별하도록 PRBS를 분석하는 것, 및 특성을 기술하는 메트릭 데이터를 생성하는 것을 포함한다. A data link layer generates flits comprising data link layer information, including cyclic redundancy check information. A flit can contain a plurality of slots,...

Full description

Saved in:
Bibliographic Details
Main Authors SHAH RAHUL C, JUE DARREN S, KUMAR ARVIND, IYER VENKATRAMAN
Format Patent
LanguageEnglish
Korean
Published 16.01.2017
Subjects
Online AccessGet full text

Cover

Loading…
Abstract 데이터 링크는 링크의 초기화 동안 적응된다. 링크의 적응은, 원격 에이전트로부터 의사난수 이진 시퀀스(PRBS)를 수신하는 것, 데이터 링크의 특성을 식별하도록 PRBS를 분석하는 것, 및 특성을 기술하는 메트릭 데이터를 생성하는 것을 포함한다. A data link layer generates flits comprising data link layer information, including cyclic redundancy check information. A flit can contain a plurality of slots, wherein one slot can carry a credit return, another can carry data, and unused slots are set to an all zero state.
AbstractList 데이터 링크는 링크의 초기화 동안 적응된다. 링크의 적응은, 원격 에이전트로부터 의사난수 이진 시퀀스(PRBS)를 수신하는 것, 데이터 링크의 특성을 식별하도록 PRBS를 분석하는 것, 및 특성을 기술하는 메트릭 데이터를 생성하는 것을 포함한다. A data link layer generates flits comprising data link layer information, including cyclic redundancy check information. A flit can contain a plurality of slots, wherein one slot can carry a credit return, another can carry data, and unused slots are set to an all zero state.
Author SHAH RAHUL C
KUMAR ARVIND
JUE DARREN S
IYER VENKATRAMAN
Author_xml – fullname: SHAH RAHUL C
– fullname: JUE DARREN S
– fullname: KUMAR ARVIND
– fullname: IYER VENKATRAMAN
BookMark eNrjYmDJy89L5WTQ8fB091AIcA1y8w_ydfRzdlXw9AtxDXL29_NzdQ5RCPCIDPZ0dvRR8HGMdA3iYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBobmBgYGphaW5o7GxKkCAC_GJ_M
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
Physics
DocumentTitleAlternate 고성능 인터커넥트 물리 계층
ExternalDocumentID KR20170005897A
GroupedDBID EVB
ID FETCH-epo_espacenet_KR20170005897A3
IEDL.DBID EVB
IngestDate Fri Jul 19 12:51:13 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
Korean
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_KR20170005897A3
Notes Application Number: KR20177000400
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170116&DB=EPODOC&CC=KR&NR=20170005897A
ParticipantIDs epo_espacenet_KR20170005897A
PublicationCentury 2000
PublicationDate 20170116
PublicationDateYYYYMMDD 2017-01-16
PublicationDate_xml – month: 01
  year: 2017
  text: 20170116
  day: 16
PublicationDecade 2010
PublicationYear 2017
RelatedCompanies INTEL CORPORATION
RelatedCompanies_xml – name: INTEL CORPORATION
Score 3.0510874
Snippet 데이터 링크는 링크의 초기화 동안 적응된다. 링크의 적응은, 원격 에이전트로부터 의사난수 이진 시퀀스(PRBS)를 수신하는 것, 데이터 링크의 특성을 식별하도록 PRBS를 분석하는 것, 및 특성을 기술하는 메트릭 데이터를 생성하는 것을 포함한다. A data link layer...
SourceID epo
SourceType Open Access Repository
SubjectTerms CALCULATING
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
Title HIGH PERFORMANCE INTERCONNECT PHYSICAL LAYER
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170116&DB=EPODOC&locale=&CC=KR&NR=20170005897A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7U-rwpanxUQ6LhJLGUZw_EtAuIVh5BNO2pgQUSo4FGMP59d1eqPfW4s8lkdpNvZ1_zfQDXWMEDA-tDMTOSQlQyoy8mKYG7qmJJx_JQSzVaKOz5mvuiPE7VaQc-lrUwjCf0m5EjEkRhgveGrdeL_0ssi_2trG_TN2Kq7pzYtIT2dEzJxSVNsMamHQZWgASEzEkk-NFvH9PQ00cbsEk30pRp334d07qUxWpScfZhKyT-yuYAOu8VB7toqb3GwY7XPnlzsM3-aOKaGFsc1odw4z7cu3xoR-QM51F5GZ5R26LA920U86E7e6Y8B_zTaGZHR3Dl2DFyRRLA_G-880m0Gq18DN2yKvMT4AlelEFf1nGRZgoVlsqlRO_nRpIWskbm9hR66zydre8-hz3apPcLktaDbvP5lV-QjNukl2yifgAJJn7Y
link.rule.ids 230,309,786,891,25594,76906
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT4NAEJ7U-qg3RY2PqiQaThKhPHtoTLuA1JZHEE17IrDQxGhoYzH-fXdXqj31OpNsZjf5dnZmZ74BuMUq7pjY6Iq5mc5ENTclMc0I3DUNywZWunqm00Zhz9fdF_Vpok0a8LHqhWE8od-MHJEgChO8V-y-XvwnsSxWW7m8z96IaP7gxD1LqKNjSi4u64I16NlhYAVIQKg3igQ_-tWxGXpGfwu2DcrPSx9PrwPal7JYdyrOAeyEZL2yOoTG-5yDFlrNXuNgz6u_vDnYZTWaeEmENQ6XR3DnDh9dPrQjEsN5dLwMz6htUeD7Nor50J0-U54Dftyf2tEx3Dh2jFyRGJD87TcZRevWKifQLOdlcQo8wYvakRQDz7JcpYOlCjk1pMJMs5mik7M9g_amlc43q6-h5cbeOBkP_dEF7FMVzTXIehua1edXcUm8b5VdsUP7ASAYgcU
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=HIGH+PERFORMANCE+INTERCONNECT+PHYSICAL+LAYER&rft.inventor=SHAH+RAHUL+C&rft.inventor=JUE+DARREN+S&rft.inventor=KUMAR+ARVIND&rft.inventor=IYER+VENKATRAMAN&rft.date=2017-01-16&rft.externalDBID=A&rft.externalDocID=KR20170005897A