INTERCONNECT STRUCTURES AND METHODS OF FORMING SAME

• Main Authors: HUANG YING WEN, CHENG JYE YEN, HUANG YI CHUN, CHIANG WEN CHUAN, YAO CHIH HSIANG
• Format: Patent
• Language: English; Korean
• Published: 26.10.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device of an embodiment includes a first conductive feature part in a dielectric layer, and a second conductive feature part which is on the dielectric layer and is electrically connected to the first conductive feature part. The second conductive feature part includes a dual damasce...