FILM THICKNESS MEASURING APPARATUS AND FILM THICKNESS MEASURING METHOD

The present invention measures thickness distribution of an organic film formed on a substrate at a short period of time. According to an embodiment, a film thickness measurement apparatus comprises: an irradiation unit; an imaging unit; and a control unit. The irradiation unit radiates an ultraviol...

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Bibliographic Details
Main Authors YAHIRO SHUNICHI, ONOUE KOUTAROU, TANAKA SHIGEKI
Format Patent
LanguageEnglish
Korean
Published 10.10.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:The present invention measures thickness distribution of an organic film formed on a substrate at a short period of time. According to an embodiment, a film thickness measurement apparatus comprises: an irradiation unit; an imaging unit; and a control unit. The irradiation unit radiates an ultraviolet ray to a radiation area on a substrate where the organic film is formed. The imaging unit captures the radiation area where the ultraviolet ray is radiated. The control unit calculates the thickness distribution of the organic film based on brightness distribution of an image captured by the imaging unit. 기판에 형성된 유기막의 막 두께 분포를 단시간에 측정한다. 실시형태에 따른 막 두께 측정 장치는, 조사부와, 촬상부와, 제어부를 구비한다. 조사부는, 유기막이 형성된 기판 상의 조사 영역에 자외광을 조사한다. 촬상부는, 자외광의 조사를 받은 조사 영역을 촬상한다. 제어부는, 촬상부에 의해 촬상된 촬상 화상의 휘도 분포에 기초하여 유기막의 막 두께 분포를 구한다.
Bibliography:Application Number: KR20160027535