SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Provided are a semiconductor package with more improved reliability, and a manufacturing method thereof. According to an embodiment of the present invention, the method for manufacturing the semiconductor package comprises: forming semiconductor chips on a support substrate; forming a protective lay...

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Bibliographic Details
Main Authors KIM, DONG HAN, KIM, JAE CHOON, UMEMOTO MITSUO, SONG, JIK HO, CHOI, IN HO
Format Patent
LanguageEnglish
Korean
Published 10.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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