SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Provided are a semiconductor package with more improved reliability, and a manufacturing method thereof. According to an embodiment of the present invention, the method for manufacturing the semiconductor package comprises: forming semiconductor chips on a support substrate; forming a protective lay...

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Bibliographic Details
Main Authors KIM, DONG HAN, KIM, JAE CHOON, UMEMOTO MITSUO, SONG, JIK HO, CHOI, IN HO
Format Patent
LanguageEnglish
Korean
Published 10.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided are a semiconductor package with more improved reliability, and a manufacturing method thereof. According to an embodiment of the present invention, the method for manufacturing the semiconductor package comprises: forming semiconductor chips on a support substrate; forming a protective layer covering upper surfaces of the semiconductor chips; forming a molding layer covering the support substrate and the protective layer; and exposing the protective layer by etching the molding layer. 본 발명의 실시예에 따른 반도체 패키지의 제조 방법은 지지기판 상에 반도체 칩들을 형성하는 것, 상기 반도체 칩들의 상면들을 덮는 보호막을 형성하는 것, 상기 지지기판과 상기 보호막을 덮는 몰딩막을 형성하는 것, 및 상기 몰딩막을 식각하여 상기 보호막을 노출시키는 것을 포함할 수 있다.
Bibliography:Application Number: KR20150015356