RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE

• Main Authors: ARII KENJI, KOBAYASHI TAKASHI, SOGAME MASANOBU, MISHIMA HIROYUKI, MABUCHI YOSHINORI
• Format: Patent
• Language: English; Korean
• Published: 24.02.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

본 발명의 수지 조성물은, 변성 나프탈렌포름알데하이드 수지를 시아네이트화하여 얻어지는, 시안산에스테르 화합물 (A) 및 에폭시 수지 (B) 를 함유한다. The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B)....