PLATING METHOD

• Main Authors: GOMEZ LUIS A, SCALISI MARK A, LIEB BRYAN, HAZEBROUCK REBECCA LEA, THORSETH MATTHEW A, LEFEBVRE MARK
• Format: Patent
• Language: English; Korean
• Published: 07.01.2016
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

A copper electroplating bath having a surface tension of 40 mN/m is suitable for filling a via with copper, wherein such copper deposit is substantially void-free and free of surface defects. A method for filling a via in an electronic device with copper comprises: providing an acidic copper electro...